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型號(hào):ZSC31015MCREFBV1P0
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制造商:
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描述:ZSC31015 MASS CALIBR. REF. BOARD
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RoHs狀態(tài):RoHS
|
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型號(hào):ZSC31015EEG1-R
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 8SOIC
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RoHs狀態(tài):RoHS
|
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型號(hào):ZSC31050FAG1-T
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 16SSOP
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RoHs狀態(tài):RoHS
|
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型號(hào):ZSC31050FAC
|
制造商:
|
描述:DICE (WAFER SAWN) - FRAME
|
RoHs狀態(tài):RoHS
|
|
型號(hào):ZSC31050FEC
|
制造商:
|
描述:DICE (WAFER SAWN) - FRAME
|
RoHs狀態(tài):RoHS
|
|
型號(hào):ZSC31050FAD
|
制造商:
|
描述:DICE (WAFER SAWN) - WAFFLE PACK
|
RoHs狀態(tài):RoHS
|
|
型號(hào):ZSC31050FAB
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs狀態(tài):RoHS
|
|
型號(hào):ZSC31015EIC
|
制造商:
|
描述:DICE (WAFER SAWN) - FRAME
|
RoHs狀態(tài):RoHS
|
|
型號(hào):ZSC31015EAG1-T
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 8SOIC
|
RoHs狀態(tài):RoHS
|
|
型號(hào):ZSC31015EEC
|
制造商:
|
描述:DICE (WAFER SAWN) - FRAME
|
RoHs狀態(tài):RoHS
|
|
型號(hào):ZSC31050FAG1-R
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 16SSOP
|
RoHs狀態(tài):RoHS
|
|
型號(hào):ZSC31015EED
|
制造商:
|
描述:DICE (WAFER SAWN) - WAFFLE PACK
|
RoHs狀態(tài):RoHS
|
|
型號(hào):ZSC31050FEB
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs狀態(tài):RoHS
|
|
型號(hào):ZSC31015EEG1-T
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 8SOIC
|
RoHs狀態(tài):RoHS
|
|
型號(hào):ZSC31015EIG1-T
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 8SOIC
|
RoHs狀態(tài):RoHS
|
|
型號(hào):ZSC31015EIG1-R
|
制造商:
|
描述:IC INTERFACE SPECIALIZED 8SOIC
|
RoHs狀態(tài):RoHS
|
|
型號(hào):ZSC31015MCSV1P1
|
制造商:
|
描述:ZSC31015 MASS CALIBRATION SYSTEM
|
RoHs狀態(tài):RoHS
|
|
型號(hào):ZSC31015EEB
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs狀態(tài):RoHS
|
|
型號(hào):ZSC31015EIB
|
制造商:
|
描述:WAFER (UNSAWN) - BOX
|
RoHs狀態(tài):RoHS
|
|
型號(hào):ZSC31050BOARDV3P1S
|
制造商:
|
描述:SSC BOARD ZSC31050 V3.1 WITH SAM
|
RoHs狀態(tài):RoHS
|